Breakfast and Networking

Welcome and Introductions

• Kathy Hayashi
  IEEE Region 6 Director


• Deborah Cooper
  Past President, IEEE-USA


• Tim Lee
  IEEE-USA 2024 President Elect

Keynote: CHIPS Design Perspective

• Dr. PR. “Chidi” Chidambaram
  Vice President of Engineering and Fellow, Qualcomm

Keynote: Industry Perspective

• Shari Liss, Executive Director
  SEMI Foundation (remote)

Fireside Chat: Industry Implications

• Deirdre Hanford
  Chief Security Officer
  Synopsys


• Tim Lee
  IEEE-USA 2024 President Elect

Perspectives on Chips and CHIPS

Perspectives from the Engineering Community

• Jennifer Fong, moderator


• Dr. Andrew Kahng
  University of California, San Diego


• Michelle Thompson
  Chair, IEEE San Diego Section
  Open Research Institute, Inc.


• Wilbur Luo, Cadence

Networking Break

Perspective from Manufacturing

• Dr. Ted Cacouris
  Head of Product Development
  ASML Cymer

View from Sacramento: GO-Biz

• Michael Karavolias
  GO-Biz


• Christopher Earl
  Office of Small Business Advocate


• Robert Meyer
  Director of Economic Development
  Employment Training Panel


• Eileen Sánchez
  CASCADE Program Director
  California Office of Planning and Research

Lunch

Workforce Initiatives

• Dr. Sandeep Gupta
  University of Southern California


• Falan Yinug
  Qualcomm

What is coming next in California?

• Dr. C.K. Ken Yang
  University of California, Los Angeles


• Dr. Andrea Belz
  University of Southern California

Networking Break

Keynote: Update from CHIPS.gov and NAPMP

• Dr. Subramanian Iyer
  Director
  National Advanced Packaging Manufacturing Program (NAPMP)

Closing Remarks

• Dr. Albert Pisano
  Dean, Jacobs School of Engineering
  University of California, San Diego

Wrap-Up